Reflow soldering workshop
From Whitespace (Hackerspace Gent)
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[[File:wetrun3.png]] | [[File:wetrun3.png]] | ||
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| + | Comparing this profile to the 'ideal' solder profile, the main difference is that we do not dwell on the 'pre-heat' phase (ie. 150-200°C). This is because we could not get the temperature to rise fast enough, so we were forced to stick to a steady, slow ramp. | ||
= Results = | = Results = | ||
| − | The second run of 0603 resistors was a success | + | [[File:Smd_reflow_soldered_resistors.jpg|thumb|center|The second run of 0603 resistors was a success]] |
| − | [[File: | + | |
| + | [[File:smd_reflow_soldered_ics.jpg|thumb|center|Some very fine pitch ICs]] | ||
| − | + | The results of the final profile were excellent. The main restriction of this technology is the precise application and dosing of the solder paste, and the placement of the components. We will experiment with using stencils next time. This should improve success rate significantly. | |
| − | + | ||
{{Subpages}} | {{Subpages}} | ||
{{EventImages}} | {{EventImages}} | ||
Latest revision as of 18:54, 13 December 2011
Note: this article is about a passed event.
| Reflow soldering workshop |
|---|
|
| From 2011/12/11 14:00:00 to 2011/12/11 18:00:00 |
| Presenters ({{#arraydefine:p|johannes}}{{#arraysize:p}}warning.png"{{#arraysize:p}}" is not a number.): |
| johannes |
| Where: |
| Whitespace
Blekerijstraat 75, Gent, Belgium Loading map...
Costs 0 |
|
Reflow soldering workshop not teaching, but testing this technique
tools available
- Aoyue hot-air station
- pizza oven + sparkfun reflow controller
- solder paste
- test circuit boards
Solder profiles and background info
Contents |
[edit] Initial heater test
[edit] Programs used
Final program:
0 15s 40°C 1 150s 150°C 2 90s 215°C 3 90s 265°C 4 40s 265°C 5 120s 40°C
[edit] Final profile
Comparing this profile to the 'ideal' solder profile, the main difference is that we do not dwell on the 'pre-heat' phase (ie. 150-200°C). This is because we could not get the temperature to rise fast enough, so we were forced to stick to a steady, slow ramp.
[edit] Results
The results of the final profile were excellent. The main restriction of this technology is the precise application and dosing of the solder paste, and the placement of the components. We will experiment with using stencils next time. This should improve success rate significantly.
Subpages
Page "Reflow soldering workshop" has no subpages to list.
Facts about Reflow soldering workshopRDF feed
| Has cost | 0 + |
| Has end date | 11 December 2011 18:00:00 + |
| Has event type | Workshop + |
| Has location | Whitespace + |
| Has presenter | Johannes + |
| Has presenter amount | |
| Has start date | 11 December 2011 14:00:00 + |
